About
I'm a PhD student in Electrical and Computer Engineering at UCLA and a graduate student researcher at the Center for Heterogeneous Integration and Performance Scaling (CHIPS). My research is on the next generation of 2.5D and 3D integrated circuit technology for AI and other high-density compute. I'm also the principal of radwan&co, an independent technical practice.
Education
- Doctor of Philosophy, Electrical and Computer Engineering (in progress) · University of California, Los Angeles (UCLA) Henry Samueli School of Engineering
- Master of Science, Computer Engineering · University of Southern California (USC) Viterbi School of Engineering
- Bachelor of Science, Computer Engineering · University of California, Los Angeles (UCLA) Henry Samueli School of Engineering
Employment
- Principal · Radwan & Company
- Graduate Student Researcher · UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS)
- SEG GPU Physical Design Engineer · Apple Inc.
- Lecturer, Department of Computer Science · California State University, Fresno
- SEG GPU Physical Design Engineering Intern · Apple Inc.
- Research and Development Intern – SRC Sponsoree · Mentor Graphics (now Siemens EDA)
Contact
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